参考文献:
[1] 王奕钧, 于德永, 周祉蕴. 青藏高原寒区水文过程研究进展及模型述评[J]. 冰川冻土, 2024, 46(4): 1312-1328.
     [2] Seneviratne, S. I., Corti, T., Davin, E. L., et al. Investigating soil moisture-climate interactions in a changing climate: a review [J]. Earth-Science Reviews, 2010: 99(3-4):125-161.
     [3] 崔娟娟, 信忠保, 黄艳章. 2003-2020年青藏高原冻融侵蚀时空变化特征[J]. 生态学报, 2023, 43(11): 4515-4526.
     [4] Yang, K., Wu, H., Qin, J., et al. Recent climate changes over the Tibetan Plateau and their impacts on energy and water cycle: a review [J]. Global and Planetary Change, 2014, 112(1), 79-91.
     [5] 李占杰, 陈基培, 刘艳民等. 土壤水分遥感反演研究进展[J]. 北京师范大学学报(自然科学版), 2020, 56(3): 474-481.
     [6] 覃湘栋, 庞治国, 江威等. 土壤水分微波反演方法进展和发展趋势[J]. 地球信息科学学报, 2021, 23(10): 1728-1742.
     [7] Dorigo, W., Wagner, W., Albergel, C., et al. ESA CCI soil moisture for improved Earth system understanding: state-of-the art and future directions [J]. Remote Sensing of Environment, 2017, 203: 185-215.
     [8] Entekhabi, D., Njoku, E. G., O’Neill, P. E., et al. The Soil Moisture Active Passive (SMAP) mission [J]. Proceedings of the IEEE, 2010, 98(5): 704-716.
     [9] Muñoz-Sabater, J., Dutra, E., Agustí-Panareda, A., et al. ERA5-Land: a state-of-the-art global reanalysis dataset for land applications [J]. Earth System Science Data, 2021, 13(9): 4349-4383.
     [10] Eyring, V., Bony, S., Meehl, G. A., et al. Overview of the Coupled Model Intercomparison Project Phase 6 (CMIP6) experimental design and organization [J]. Geoscientific Model Development, 2016, 9(5): 1937-1958.
     [11] McColl, K. A., Vogelzang, J., Konings, A. G., et al. Extended triple collocation: estimating errors and correlation coefficients with respect to an unknown target [J]. Geophysical Research Letters, 2014, 41(17): 6229-6236.
     [12] 付平凡, 杨晓静, 姜波等. 融合多源数据的高分辨率土壤水分模拟模型构建及应用[J]. 农业工程学报, 2025, 41(5): 96-106.
     [13] 范科科, 张强, 史培军等. 基于卫星遥感和再分析数据的青藏高原土壤湿度数据评估[J]. 地理学报, 2018, 73(9): 1778-1791.
     [14] 张镱锂. 青藏高原边界数据总集[DB/OL]. 国家青藏高原科学数据中心, 2019. https://doi.org/10.11888/Geogra.tpdc.270099. https://cstr.cn/18406.11.Geogra.tpdc.270099.